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FDI, the unified solution for device integration


Since the introduction of fieldbus technology into factory and process automation, two competing technologies for device integration (EDDL and FDT/DTM) have developed on the market with different scopes of application and different advantages but unfortunately with no migration path between the both. Therefore, end users had and still have to decide for one of the two while device manufacturers are forced to invest in parallel developments. To end this unsatisfying situation and responding to growing market demands, the two responsible organisations (“FDT Group” and “EDDL Cooperation Team”) decided early in 2007 to combine their efforts and to work towards a unified solution for device integration (FDI, Future Device integration) that is compatible with both technologies.

While there is not yet a final solution available, concrete ideas and concepts exist and are further developed in technical teams. A white paper published by itm (Technical University of Munich) describes a device integration concept that combines the advantages of EDDL with those of FDT: The concept uses textual description for basic integration work and allows the use of software for advanced applications.
The concept is based on the new “Unified Architecture” of the OPC Foundation (OPC UA) with its clearly separated Device Information Model (DIM) and Device Operation Model (DOM).

FDI shall be an open specification and get an international IEC standard. Draft specifications and first prototypes are expected by end of 2008.

Intended features and user benefits at a glance

This project will certainly contribute to further accelerate the distribution of PROFIBUS PA in all sections of the process industry.

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