Device manufacturers will now have access to an innovative netX network controller from Hilscher Gesellschaft für Systemautomation mbH with integrated PROFINET functionality. PI (PROFIBUS & PROFINET International) welcomes this hardware-related realization of PROFINET functions and anticipates - also due to its comparable price to a fieldbus interface - widespread acceptance within industry. Integrated blocks are the basis for easy, fast integration of PROFINET in devices of numerous manufacturers.
In addition to the new specifications required for process automation, the current PROFINET Specification V2.3 also describes mechanisms for performance optimization. These new functionalities (e.g., Dynamic Frame Packaging DFP) enable unsurpassed performance, even in the case of minimum I/O in a line configuration, and are totally integrated at the hardware level in the new netX.
As member of PI for many years and due to active participation in various technical and marketing working groups, Hilscher was in a position to influence the new PROFINET specifications from the outset. Thus, Hilscher was instrumental in developing the various PROFINET functions, from the initial concept to the finished specification. As a result of this participation, Hilscher could also carry out work simultaneously to ensure timely development of technology products that conform to the specification.
Statement by Hans-Jürgen Hilscher, Managing Director of Hilscher Gesellschaft für Systemautomation mbH:
“Technically speaking, we are taking a major step forward. After six years in the market, Hilscher will introduce enhancements to its netX network controller family at SPS/IPC/DRIVES. The new ASICs support the PROFINET Specification V2.3 through use of the Dynamic Frame Packaging function that is optimized for high performance. In cooperation with Renesas Electronics Europe GmbH, Hilscher announces the development of a high-end controller in 40 nm technology. PLCs, drives, and terminals with PROFINET IRT can thus be configured as a compact, single-chip solution.”